Business Media China AG
Business Media China AG was originally created and developed by MESAGO HOLDING. MESAGO - Messe & Kongress GmbH is one of the largest names in the international exhibition and conference industry with world leading events such as SMT / HYBRID / PACKAGING in Nuremberg and many more. This company was founded in 1982 by Klaus M. Hilligardt, Chairman of Business Media China AG, and later integrated into MESAGO HOLDING. Business Media China AG is the guarantor for highest standards and successful international participation in technology events.
In Shanghai and throughout China, Business Media China has a team of highly qualified exhibition and conference professionals to develop the group's technology exhibition and conference program. China SMT Forum is the first event of a series of technology forums.

Industrial Backgroud and Development
Rapid developments in the industry and consumer demands generate electronic products that are characterized by smaller-size, high functionality and increased reliability. These trends require constantly new components which are produced by new packaging technologies.
With the packaging size getting increasingly smaller, there will be a need for the assembling equipment to catch up with more precise and advanced technology in order to meet the new manufacturing standards. The gap between the suppliers of electronic assembly equipment and the semiconductor industry is going to become more and more smaller, forced by the increasing exchange of technology developments in both sectors.. For example, new packaging technologies like BGA, CSP, etc., are effecting the development of Surface Mount Devices which are one of most important driving forces for innovations in the SMT field.
Environmental protection will also set new trends for the industries development. Especially Photovoltaic and LED products will raise the demand for electronic devices and new packaging technologies in China. And all these new products will need OEM and ODM to improve their capabilities on a higher manufacturing level.
In order to meet these industrial trends, BMC will present the China SMT Forum 2008 at the INTEX Shanghai from November 4-6, 2008. At the conference and the co-located exhibition for electronic packaging and assembly technology, you will meet your suppliers and clients, specialists and key people from science and industry in packaging and assembling fields.

You will meet the delegate from
Electronic Manufacturer (OEM/ODM/EMS)
Communication Systems or Services
Automotive Electronics or Transportation
Computer, Systems and Peripheral Equipment
Electronics, Semiconductors and ICs
Photonics (lasers, laser systems, photovoltaics)
Medical / Hospital and Biotechnology Equipment
Industrial Electronics
Micro systems / Mechatronics / Nanotechnology
Aerospace / Aviation Systems
Electro-Optical Components, Detectors, Sensors and Cameras
Analytical, Test & Measurement Equipment, Quality Assurance
Automation & robotics, Industrial Control Systems
EHS - Environment, Health, Safety Monitoring
Electronics: PCBs, Assemblies, Components
Publications, Printing, Graphic Arts R&D Software (control, etc.)
Manufacturing Equipment, Machinery, Metal Poducts
Others

Exhibits
Packaging & Testing Equipment
Assembly Equipment
Electronic Modules, Assemblies, Components and devices
Materials and Tools
IC Design
EMS/OEM
Software
Consulting & Services
Publications
Others

A conference focus on Packaging/Assembly/SMT
The conference will welcome speakers and delegates from electronic packaging, assembly and system intergration related industry to the most progressive trading platform in China
Quality, competence, and an intimate atmosphere for intensive networking are the conceptual ingredients of the China SMT Forum 2008.
The competence of internationally renowned speakers guarantees the high level of the China SMT Forum 2008.
The continuing fertile relationship with the Fraunhofer IZM, Berlin and further international institutions guarantees the presence of the most up-to-date technology at the China SMT Forum 2008.
Additionally an exclusive exhibition offers selected companies the opportunity to present their products to a highly qualified expert audience.

Conference Topic:
Lead-free implementation
PCB and Semiconductor Packaging
Assembly and Soldering
Reliability
Markets and Trends
(For more information, please contact organizer)

Committee Members

Chairman
Professor Mathias Nowottnick (University Rostock)

Vice Chairman
Professor Thomas Gessner (Chemnitz University)
Professor Bernd Michel (University of Berlin)
Rolf Aschenbrenner(Fraunhofer Institute for Reliability and Microintegration)

China Committee Members
Mr. Bi Keyun, Vice Chairman of China Semiconductor Industry Association(CSIA), Director of Packaging Branch of CSIA
Mr. Jin Cunzhong, China Electronic Equipment Industry Association
Mr. Jerry Liang, CTO of Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET)
Mr. Jack Ding, SMT Materials and Semiconductor & Packaging Materials BU, Manager of Heraeus Materials Technology Shanghai Ltd.
Mr. Wang Xingqian, Shanghai Electronic Components Trade Association
Prof. Li Ming, Shanghai Jiaotong University

Contact:
Business Media China Co., Ltd. Shanghai Branch
Address: 17H, No.18, North Caoxi Road, Shanghai, 200030, China
Contact: Steven Wu, Kelly Zhu, Barry Bai